PCB Specifications
Advanced Options
Assembly Specifications
Assembly Options
PCB Stackup Visualizer
Trace Width Calculator
Minimum Trace Width
-- mil
Via Current Calculator
Max Current per Via
-- A
Microstrip Impedance
Characteristic Impedance
-- Ω
Panelization Calculator
Boards per Panel
-- pcs
Cost Optimization Tips
Reduce your PCB fabrication costs with these strategies:
- Use standard board thickness (1.6mm)
- Keep trace/space at 6/6 mil or above
- Minimize via count and avoid blind/buried vias
- Use green solder mask (standard color)
- Order in larger quantities for volume discounts
Layer Stackup Guidelines
Optimize your PCB stackup for performance and cost:
- 2-layer: Best for simple designs, lowest cost
- 4-layer: Add ground/power planes for better EMC
- 6+ layers: Complex routing, high-speed designs
- Keep signal layers adjacent to reference planes
- Balance copper on outer layers to prevent warping
Component Placement
Improve assembly yield with proper placement:
- Group similar components together
- Orient polarized parts consistently
- Keep 50mil spacing between SMD parts
- Place tall parts away from edges
- Add fiducials for pick-and-place accuracy
DFM Best Practices
Design for manufacturability essentials:
- Maintain minimum annular ring (5mil+)
- Add teardrops to pad-trace connections
- Use thermal relief on plane connections
- Keep copper away from board edge (10mil)
- Avoid acid traps in copper pours
Surface Finish Selection
Choose the right finish for your application:
- HASL: Low cost, good solderability
- ENIG: Flat surface, gold wire bonding
- OSP: Eco-friendly, short shelf life
- Immersion Silver: Good for RF
- Hard Gold: Connector edge fingers
Assembly Optimization
Reduce assembly costs and improve quality:
- Consolidate parts to reduce unique components
- Use standard package sizes (0402, 0603, 0805)
- Avoid mixed technology if possible
- Add test points for production testing
- Include clear assembly drawings and BOM
DFM Checklist
Minimum Trace Width
Ensure traces meet minimum width requirements (6 mil standard)
Minimum Spacing
Verify spacing between traces, pads, and vias (6 mil standard)
Annular Ring Check
Minimum annular ring of 5 mil for through-hole vias
Drill to Copper Clearance
Maintain 8 mil clearance from drill holes to copper
Board Edge Clearance
Keep copper 10 mil from board edges
Silkscreen Clearance
Silkscreen text away from pads and vias
Solder Mask Opening
Proper solder mask expansion on pads (2-3 mil)
Fiducials Added
Include at least 3 fiducial marks for SMT assembly
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